Analysis demonstrated that the design with heat pipes running above the components kept junction temperatures within 2 c of the original.
Most efficient heat sink design.
These designs are designed for thermal efficiency but contained by manufacturing process.
To efficiently move thermal energy away from a heat generating component the heat sink must have high thermal conductivity.
Some of the more common construction materials for heat sinks are aluminum and copper.
In computers heat sinks are used to cool cpus gpus and some chipsets and ram modules.
Bonded fin heat sinks use separate base and fins assembled to form a heat sink figure 3.
Bonded fin heat sinks.
A heat sink also commonly spelled heatsink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium often air or a liquid coolant where it is dissipated away from the device thereby allowing regulation of the device s temperature.
Ats engineers used analytical modeling and cfd simulations to examine the thermal performance of two aluminum heat sink designs.
They are produced from a solid block of metal.
Bonded fin heat sinks generally offer moderate performance and come at a high cost.
Heat sinks produced through this method are normally made from copper.
When designing a heat sink for a cpu cooler what is the optimal design.
3 skived heat sinks.
For over a decade these parts have offered an alternative to the limitations of the extrusion process.
Increases in cooling surface area of 200 to 300 allow significant decreases in heat sink volume.
Currently fins are used extensively and rods are also available however are more expensive.